STM32L471QEI6 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

STM32L471QEI6
Manufacturer

ST Microelectronics
ChipWorker Part#

CW77366062
Category

Microcontroller, MCU IC
Package

UFBGA-132
Description

MCU 32Bit ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 132Pin UFBGA Tray
Documentation

Datasheet

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STM32L471QEI6 Specifications

Attribute	Attribute Value

Part Number	STM32L471QEI6
Manufacturer	ST Microelectronics
ChipWorker Part#	CW77366062
Category	Microcontroller, MCU IC
Documentation	Datasheet
Number of Pins	132 Pin
Case/Package	UFBGA-132
Frequency	80 MHz
Number of Positions	132 Position
RAM Memory Size	128 KB
Number of Bits	32 Bit
Power Dissipation	363 mW
Number of ADCs	3 ADC
Number of Inputs and Outputs	109 Input IO
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	363 mW
Number of DACs	1 DAC
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	1.71 V
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Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status
ECCN Code	3A991A2

Product Description

The STM32L471xx devices are the ultra-low-power microcontrollers based on the high-performance ARM® Cortex®-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32L471xx devices embed high-speed memories (Flash memory up to 1 Mbyte, up to 128 Kbyte of SRAM), a flexible external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), a Quad SPI flash memories interface (available on all packages) and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
The STM32L471xx devices embed several protection mechanisms for embedded Flash memory and SRAM: readout protection, write protection, proprietary code readout protection and Firewall.
The devices offer up to three fast 12-bit ADCs (5 Msps), two comparators, two operational amplifiers, two DAC channels, an internal voltage reference buffer, a low-power RTC, two general-purpose 32-bit timer, two 16-bit PWM timers dedicated to motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The devices support four digital filters for external sigma delta modulators (DFSDM).
In addition, up to 24 capacitive sensing channels are available.
They also feature standard and advanced communication interfaces.
**Key Features**
Ultra-low-power with FlexPowerControl
1.71 V to 3.6 V power supply
-40 °C to 85/105/125 °C temperature range
300 nA in VBAT mode: supply for RTC and 32x32-bit backup registers
30 nA Shutdown mode (5 wakeup pins)
120 nA Standby mode (5 wakeup pins)
420 nA Standby mode with RTC
1.1 μA Stop 2 mode, 1.4 μA Stop 2 with RTC
100 μA/MHz run mode
Batch acquisition mode (BAM)
4 μs wakeup from Stop mode
Brown out reset (BOR) in all modes except shutdown
Interconnect matrix
Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS/1.25DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Clock Sources
4 to 48 MHz crystal oscillator
32 kHz crystal oscillator for RTC (LSE)
Internal 16 MHz factory-trimmed RC (±1%)
Internal low-power 32 kHz RC (±5%)
Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)
3 PLLs for system clock, audio, ADC
RTC with HW calendar, alarms and calibration
Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors
16x timers: 2 x 16-bit advanced motor-control, 2 x 32-bit and 5 x 16-bit general purpose, 2x 16-bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer
Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V
Memories
Up to 1 MB Flash, 2 banks read-while-write, proprietary code readout protection
Up to 128 KB of SRAM including 32 KB with hardware parity check
External memory interface for static memories supporting SRAM, PSRAM, NOR and NAND memories
Quad SPI memory interface
4x digital filters for sigma delta modulator
Rich analog peripherals (independent supply)
3× 12-bit ADC 5 Msps, up to 16-bit with hardware oversampling, 200 μA/Msps
2x 12-bit DAC, low-power sample and hold
2x operational amplifiers with built-in PGA
2x ultra-low-power comparators
17x communication interfaces
2x SAIs (serial audio interface)
3x I2C FM+(1 Mbit/s), SMBus/PMBus
6x USARTs (ISO 7816, LIN, IrDA, modem)
3x SPIs (4x SPIs with the Quad SPI)
CAN (2.0B Active) and SDMMC interface
SWPMI single wire protocol master I/F
14-channel DMA controller
True random number generator
CRC calculation unit, 96-bit unique ID
Development support: serial wire debug (SWD), JTAG, Embedded Trace Macrocell™

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