TBD62783APG - Toshiba

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TBD62783APG
Manufacturer

Toshiba
ChipWorker Part#

CW3304530
Category

Switching Controller
Package

DIP-18
Description

IC LOAD SWITCH 8CH 0.5A 18DIP
Documentation

Datasheet

TBD62783APG Global Supplier

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TBD62783APG Specifications

Attribute	Attribute Value

Part Number	TBD62783APG
Manufacturer	Toshiba
ChipWorker Part#	CW3304530
Category	Switching Controller
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	18 Pin
Case/Package	DIP-18
Number of Outputs	8 Output
Supply Current	0.1 mA
Power Dissipation	1470 mW
Output Current (Max)	500 mA
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	1470 mW
Input Voltage	2V ~ 25V
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Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	New Product
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Power Switch/Driver 1:1 P-Channel 500mA 18-DIP

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Delivery

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TNT

EMS

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SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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