TFP410PAP - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TFP410PAP
Manufacturer

TI
ChipWorker Part#

CW7567096
Category

Interface IC, Interface Controller
Package

HTQFP-64
Description

DVI TRANSMITTER, 3.6V, HTQFP-64
Documentation

Datasheet

TFP410PAP Global Supplier

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TFP410PAP Specifications

Attribute	Attribute Value

Part Number	TFP410PAP
Manufacturer	TI
ChipWorker Part#	CW7567096
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	64 Pin
Case/Package	HTQFP-64
Frequency	26 MHz
Supply Voltage (DC)	3.30 V
Supply Current	200 mA
Number of Channels	3 Channel
Number of Positions	64 Position
Power Dissipation	3.26 W
Data Rate	495 Mbps
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage	3V ~ 3.6V
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	3 V
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Size-Length	10 mm
Size-Width	10 mm
Size-Height	1 mm
Weight	0.0041313195792 kg
Operating Temperature	-55℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2014/12/17
ECCN Code	EAR99

Product Description

The TFP410PAP is a 165MHz Panel Bus DVI Transmitter provides a universal interface to allow a glueless connection to most commonly available graphics controllers. Some of the advantages of this universal interface include selectable bus widths, adjustable signal levels and differential and single-ended clocking. The adjustable digital interface provides a low-EMI, high-speed bus that connects seamlessly with interfaces. The DVI interface supports flat-panel display resolutions up to UXGA at 165MHz in 24-bit true colour pixel format.
Digital Visual Interface (DVI) compliant
Universal graphics controller interface
Enhanced PLL noise immunity
Enhanced jitter performance
Programmable using I²C serial interface
Monitor detection through hot-plug and receiver detection
Green product and no Sb/Br
This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Electrical testing
- Surface testing

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