TLP2662 - Toshiba

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TLP2662
Manufacturer

Toshiba
ChipWorker Part#

CW106101404
Category

Optocoupler, Optoisolator
Package

DIP-8
Description

TOSHIBA TLP2662 Digital Output Optocoupler, 2Channel, DIP, 8Pins, 5kV, 10 Mbaud
Documentation

Datasheet

TLP2662 Global Supplier

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TLP2662 Specifications

Attribute	Attribute Value

Part Number	TLP2662
Manufacturer	Toshiba
ChipWorker Part#	CW106101404
Category	Optocoupler, Optoisolator
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	8 Pin
Case/Package	DIP-8
Number of Channels	2 Channel
Number of Positions	8 Position
Rise Time	12 ns
Isolation Voltage	5 kV
Input Current (Min)	15 mA
Maximum Forward Voltage (Max)	1.7 V
Fall Time	3 ns
	expand all
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Pre-Shipment Inspection (PSI) will be used when ordering.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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