TLP3052 - Toshiba

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TLP3052
Manufacturer

Toshiba
ChipWorker Part#

CW142899132
Category

Optocoupler, Optoisolator
Package

PDIP-6
Description

Optocoupler Triac AC-OUT 1CH 600VDRM 5Pin PDIP
Documentation

Datasheet

TLP3052 Global Supplier

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TLP3052 Specifications

Attribute	Attribute Value

Part Number	TLP3052
Manufacturer	Toshiba
ChipWorker Part#	CW142899132
Category	Optocoupler, Optoisolator
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	5 Pin
Case/Package	PDIP-6
Output Voltage	600 V
Power Dissipation	330 mW
Operating Temperature (Max)	100 ℃
Operating Temperature (Min)	-40 ℃
	expand all
Size-Length	7.12 mm
Size-Width	6.4 mm
Size-Height	3.65 mm
Product Lifecycle Status	Active
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVERSOLID STATE RELAY
The TOSHIBA TLP3051(S) and TLP3052(S) consists of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package.
• Peak Off-State Voltage : 600V(Min)
• Trigger LED Current : 15mA(Max) (TLP3051(S))
10mA(Max) (TLP3052(S))
• On-State Current : 100mA(Max)
• Isolation Voltage : 5000Vrms(Min)
• UL Recognized : UL1577, File No.E67349
• SEMKO Approved : SS EN60065
SS EN60950, File No.9841111
• BSI Approved : BS EN60065, File No.8385
BS EN60950, File No.8386
• Option (D4) type
VDE approved: DIN EN60747-5-2
Approved No. 40009302
Maximum operating insulation voltage: 890VPK
Highest permissible over voltage: 8000VPK
(Note):When a EN60747-5-2 approved type is needed,
please designate the "Option (D4)"

expand all

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- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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