TMS320C6711DZDP200 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320C6711DZDP200
Manufacturer

TI
ChipWorker Part#

CW19448571
Category

DSP, Digital Signal Processor
Package

BGA-272
Description

DSP Floating-Point 32Bit 200MHz 1600MIPS 272Pin BGA
Documentation

Datasheet

TMS320C6711DZDP200 Global Supplier

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TMS320C6711DZDP200 Specifications

Attribute	Attribute Value

Part Number	TMS320C6711DZDP200
Manufacturer	TI
ChipWorker Part#	CW19448571
Category	DSP, Digital Signal Processor
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	272 Pin
Case/Package	BGA-272
Frequency	200 MHz
Supply Voltage (DC)	1.20 V
Clock Speed	200 MHz
RAM Memory Size	73728 B
Number of Bits	32 Bit
Number of I/O Pins	5 IO
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
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Size-Length	27 mm
Size-Width	27 mm
Size-Height	1.78 mm
Operating Temperature	0℃ ~ 90℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	3A991.a.2

Product Description

description
The TMS320C67x DSPs (including the TMS320C6711, TMS320C6711B, TMS320C6711C, TMS320C6711D devices†) compose the floating-point DSP family in the TMS320C6000 DSP platform. The C6711, C6711B, C6711C, and C6711D devices are based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for multichannel and multifunction applications.
• Excellent-Price/Performance Floating-Point Digital Signal Processor (DSP): TMS320C6711D
− Eight 32-Bit Instructions/Cycle
− 167-, 200-, 250-MHz Clock Rates
− 6-, 5-, 4-ns Instruction Cycle Time
− 1000, 1200, 1500 MFLOPS
• Advanced Very Long Instruction Word (VLIW) C67x™ DSP Core
− Eight Highly Independent Functional Units:
− Four ALUs (Floating- and Fixed-Point)
− Two ALUs (Fixed-Point)
− Two Multipliers (Floating- and Fixed-Point)
− Load-Store Architecture With 32 32-Bit
General-Purpose Registers
− Instruction Packing Reduces Code Size
− All Instructions Conditional
• Instruction Set Features
− Hardware Support for IEEE
Single-Precision and Double-Precision Instructions
− Byte-Addressable (8-, 16-, 32-Bit Data)
− 8-Bit Overflow Protection
− Saturation
− Bit-Field Extract, Set, Clear
− Bit-Counting
− Normalization
• L1/L2 Memory Architecture
− 32K-Bit (4K-Byte) L1P Program Cache (Direct Mapped)
− 32K-Bit (4K-Byte) L1D Data Cache (2-Way Set-Associative)
− 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache (Flexible Data/Program Allocation)
• Device Configuration
− Boot Mode: HPI, 8-, 16-, 32-Bit ROM Boot
− Endianness: Little Endian, Big Endian
• Enhanced Direct-Memory-Access (EDMA) Controller (16 Independent Channels)
• 32-Bit External Memory Interface (EMIF)
− Glueless Interface to Asynchronous Memories: SRAM and EPROM
− Glueless Interface to Synchronous Memories: SDRAM and SBSRAM
− 256M-Byte Total Addressable External Memory Space
• 16-Bit Host-Port Interface (HPI)
• Two Multichannel Buffered Serial Ports (McBSPs)
− Direct Interface to T1/E1, MVIP, SCSA Framers
− ST-Bus-Switching Compatible
− Up to 256 Channels Each
− AC97-Compatible
− Serial-Peripheral-Interface (SPI) Compatible (Motorola)
• Two 32-Bit General-Purpose Timers
• Flexible Software Configurable PLL-Based Clock Generator Module
• A Dedicated General-Purpose Input/Output (GPIO) Module With 5 Pins
• IEEE-1149.1 (JTAG†) Boundary-Scan-Compatible
• 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffixes)
• CMOS Technology
− 0.13-µm/6-Level Copper Metal Process
• 3.3-V I/O, 1.4-V Internal (−250)
• 3.3-V I/O, 1.20-V Internal ‡

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