TMS320F2812GHHA - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320F2812GHHA
Manufacturer

TI
ChipWorker Part#

CW4494153
Category

Microcontroller, MCU IC
Package

BGA-179
Description

DSP, Fixed Point, 32Bit, 150MHz, 256KB, BGA, 179Pins
Documentation

Datasheet

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TMS320F2812GHHA Specifications

Attribute	Attribute Value

Part Number	TMS320F2812GHHA
Manufacturer	TI
ChipWorker Part#	CW4494153
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	179 Pin
Case/Package	BGA-179
Frequency	150 MHz
Supply Voltage (DC)	1.81V (min)
Number of Positions	179 Position
Clock Speed	150 MHz
RAM Memory Size	18K x 16
Number of Bits	32 Bit
FLASH Memory Size	256 KB
Number of I/O Pins	56 IO
Number of UARTs	2 UART
Number of ADCs	1 ADC
Number of Inputs and Outputs	56 IO
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	Non-Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2018/06/27
ECCN Code	3A991.a.2

Product Description

* High-Performance Static CMOS Technology * 150 MHz (6.67-ns Cycle Time) * Low-Power (1.8-V Core at 135 MHz, 1.9-V Core at 150 MHz, 3.3-V I/O) Design * JTAG Boundary Scan Support IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture * High-Performance 32-Bit CPU (TMS320C28x) * 16 x 16 and 32 x 32 MAC Operations * 16 x 16 Dual MAC * Harvard Bus Architecture * Atomic Operations * Fast Interrupt Response and Processing * Unified Memory Programming Model * 4M Linear Program/Data Address Reach * Code-Efficient (in C/C++ and Assembly) * TMS320F24x/LF240x Processor Source Code Compatible * On-ChipMemory * Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors) * ROM Devices: Up to 128K x 16 ROM * 1K x 16 OTP ROM * L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM) * H0: 1 Block of 8K x 16 SARAM * M0 and M1: 2 Blocks of 1K x 16 Each SARAM * Boot ROM (4K x16) * With Software Boot Modes * Standard Math Tables * External Interface(2812) * Over 1M x 16 Total Memory * Programmable Wait States * Programmable Read/Write Strobe Timing * Three Individual Chip Selects * Endianness: Little Endian * Clock and SystemControl * Dynamic PLL Ratio Changes Supported * On-Chip Oscillator * Watchdog Timer Module * Three ExternalInterrupts * Peripheral Interrupt Expansion (PIE) Block That Supports 45Peripheral Interrupts * Three 32-Bit CPU-Timers * 128-BitSecurity Key/Lock * Protects Flash/ROM/OTP and L0/L1 SARAM * Prevents Firmware Reverse-Engineering * Motor ControlPeripherals * Two Event Managers (EVA, EVB) * Compatible to 240xA Devices * Serial PortPeripherals * Serial Peripheral Interface (SPI) * Two Serial Communications Interfaces (SCIs), Standard UART * Enhanced Controller Area Network (eCAN) * Multichannel Buffered Serial Port (McBSP) * 12-Bit ADC, 16Channels * 2 x 8 Channel Input Multiplexer * Two Sample-and-Hold * Single/Simultaneous Conversions * Fast Conversion Rate: 80 ns/12.5 MSPS * Up to 56General-Purpose I/O (GPIO) Pins * Advanced EmulationFeatures * Analysis and Breakpoint Functions * Real-Time Debug via Hardware * Development ToolsInclude * ANSI C/C++ Compiler/Assembler/Linker * Code Composer Studio IDE * DSP/BIOS * JTAG Scan Controllers(1) * Low-PowerModes and Power Savings * IDLE, STANDBY, HALT Modes Supported * Disable Individual Peripheral Clocks * PackageOptions * 179-Ball MicroStar BGA With External Memory Interface (GHH, ZHH) (2812) * 176-Pin Low-Profile Quad Flatpack (LQFP) With External Memory Interface (PGF) (2812) * 128-Pin LQFP Without External Memory Interface (PBK) (2810, 2811) * Temperature Options * A: –40°C to 85°C (GHH, ZHH, PGF, PBK) * S: –40°C to 125°C (GHH, ZHH, PGF, PBK) * Q: –40°C to 125°C (PGF, PBK) [Q100 Qualification]

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