TMS320F28235ZJZS - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320F28235ZJZS
Manufacturer

TI
ChipWorker Part#

CW33849233
Category

Microcontroller, MCU IC
Package

BGA-176
Description

MCU 32Bit C28x RISC 512KB Flash 1.9V/3.3V 176Pin BGA Tray
Documentation

Datasheet

TMS320F28235ZJZS Global Supplier

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TMS320F28235ZJZS Specifications

Attribute	Attribute Value

Part Number	TMS320F28235ZJZS
Manufacturer	TI
ChipWorker Part#	CW33849233
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	176 Pin
Case/Package	BGA-176
Frequency	150 MHz
Supply Voltage (DC)	1.80V (min)
Number of Positions	176 Position
Clock Speed	150 MHz
RAM Memory Size	68 KB
Number of Bits	32 Bit
FLASH Memory Size	512 KB
Number of UARTs	3 UART
Number of ADCs	1 ADC
Number of Inputs and Outputs	88 Input IO
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.995 V
Supply Voltage (Min)	1.805 V
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Size-Length	15 mm
Size-Width	15 mm
Size-Height	1.45 mm
Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

Description
The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x/ Delfino™ DSC/MCU generation, are highly integrated, high-performance solutions for demanding control applications.
Features
• High-Performance Static CMOS Technology
– Up to 150 MHz (6.67-ns Cycle Time)
– 1.9-V/1.8-V Core, 3.3-V I/O Design
• High-Performance 32-Bit CPU (TMS320C28x)
– IEEE 754 Single-Precision Floating-Point Unit (FPU) (F2833x Only)
– 16 × 16 and 32 × 32 MAC Operations
– 16 × 16 Dual MAC
– Harvard Bus Architecture
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– Code-Efficient (in C/C++ and Assembly)
• Six-Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
• 16-Bit or 32-Bit External Interface (XINTF)
– More Than 2M × 16 Address Reach
• On-Chip Memory
– F28335, F28333, F28235: 256K × 16 Flash, 34K × 16 SARAM
– F28334, F28234: 128K × 16 Flash, 34K × 16 SARAM
– F28332, F28232: 64K × 16 Flash, 26K × 16 SARAM
– 1K × 16 OTP ROM
• Boot ROM (8K × 16)
– With Software Boot Modes (Through SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
– Standard Math Tables
• Clock and System Control
– On-Chip Oscillator
– Watchdog Timer Module
• GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
• Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
• 128-Bit Security Key/Lock
– Protects Flash/OTP/RAM Blocks
– Prevents Firmware Reverse Engineering
• Enhanced Control Peripherals
– Up to 18 PWM Outputs
– Up to 6 HRPWM Outputs With 150 ps MEP Resolution
– Up to 6 Event Capture Inputs
– Up to 2 Quadrature Encoder Interfaces
– Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs)
– Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs)
• Three 32-Bit CPU Timers
• Serial Port Peripherals
– Up to 2 CAN Modules
– Up to 3 SCI (UART) Modules
– Up to 2 McBSP Modules (Configurable as SPI)
– One SPI Module
– One Inter-Integrated Circuit (I2C) Bus
• 12-Bit ADC, 16 Channels
– 80-ns Conversion Rate
– 2 × 8 Channel Input Multiplexer
– Two Sample-and-Hold
– Single/Simultaneous Conversions
– Internal or External Reference
• Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
• JTAG Boundary Scan Support
– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug Using Hardware
• Development Support Includes
– ANSI C/C++ Compiler/Assembler/Linker
– Code Composer Studio™ IDE
– DSP/BIOS™ and SYS/BIOS
– Digital Motor Control and Digital Power Software Libraries
• Low-Power Modes and Power Savings
– IDLE, STANDBY, HALT Modes Supported
– Disable Individual Peripheral Clocks
• Endianness: Little Endian
• Package Options:
– Lead-free, Green Packaging
– Plastic Ball Grid Array (BGA) (ZJZ)
– MicroStar BGA™ (ZHH)
– Low-Profile Quad Flatpack (LQFP) (PGF)
– Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
• Temperature Options:
– A: –40°C to 85°C (PGF, ZHH, ZJZ)
– S: –40°C to 125°C (PTP, ZJZ)
– Q: –40°C to 125°C (PTP, ZJZ)
(AEC Q100 Qualification for Automotive Applications)
Applications
• Industrial AC Inverter Drives
• Industrial Servo Amplifiers and Controllers
• Computer Numerical Control (CNC) Machining
• Uninterruptible and Server Power Supplies
• Telecom Equipment Power
• Solar Inverters

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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