TMS320F28335ZJZQ - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320F28335ZJZQ
Manufacturer

TI
ChipWorker Part#

CW16050936
Category

Microcontroller, MCU IC
Package

BGA-176
Description

MCU 32Bit C28x RISC 512KB Flash 1.9V/3.3V 176Pin BGA
Documentation

Datasheet

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TMS320F28335ZJZQ Specifications

Attribute	Attribute Value

Part Number	TMS320F28335ZJZQ
Manufacturer	TI
ChipWorker Part#	CW16050936
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	176 Pin
Case/Package	BGA-176
Frequency	150 MHz
Supply Voltage (DC)	1.80V (min)
Number of Positions	176 Position
Clock Speed	150 MHz
RAM Memory Size	68 KB
FLASH Memory Size	512 KB
Number of UARTs	3 UART
Number of ADCs	1 ADC
Number of Inputs and Outputs	88 Input IO
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.995 V
Supply Voltage (Min)	1.805 V
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Size-Length	15 mm
Size-Width	15 mm
Size-Height	1.16 mm
Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

* High-Performance Static CMOS Technology * Up to 150 MHz (6.67-ns Cycle Time) * 1.9-V/1.8-V Core, 3.3-V I/O Design * High-Performance 32-Bit CPU (TMS320C28x) * IEEE-754 Single-Precision Floating-Point Unit (FPU) (F2833x only) * 16 x 16 and 32 x 32 MAC Operations * 16 x 16 Dual MAC * Harvard Bus Architecture * Fast Interrupt Response and Processing * Unified Memory Programming Model * Code-Efficient (in C/C++ and Assembly) * Six-Channel DMA Controller (for ADC, McBSP,ePWM, XINTF, and SARAM) * 16-Bit or 32-Bit External Interface (XINTF) * Over 2M x 16 Address Reach * On-Chip Memory * F28335, F28235: 256K x 16 Flash, 34K x 16 SARAM * F28334, F28234: 128K x 16 Flash, 34K x 16 SARAM * F28332, F28232: 64K x 16 Flash, 26K x 16 SARAM * 1K x 16 OTP ROM * Boot ROM (8K x 16) * With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O) * Standard Math Tables * Clock and System Control * Dynamic PLL Ratio Changes Supported * On-Chip Oscillator * Watchdog Timer Module * GPIO0 to GPIO63 Pins Can Be Connected to One of the EightExternal Core Interrupts * Peripheral Interrupt Expansion (PIE) Block That Supports All58Peripheral Interrupts * 128-Bit Security Key/Lock * Protects Flash/OTP/RAM Blocks * Prevents Firmware Reverse Engineering * EnhancedControl Peripherals * Up to 18 PWM Outputs * Up to 6 HRPWM Outputs With 150 ps MEP Resolution * Up to 6 Event Capture Inputs * Up to 2 Quadrature Encoder Interfaces * Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs) * Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs) * Three 32-Bit CPU Timers * Serial Port Peripherals * Up to 2 CAN Modules * Up to 3 SCI (UART) Modules * Up to 2 McBSP Modules (Configurable as SPI) * One SPI Module * One Inter-Integrated-Circuit (I2C) Bus * 12-Bit ADC, 16 Channels * 80-ns Conversion Rate * 2 x 8 Channel Input Multiplexer * Two Sample-and-Hold * Single/Simultaneous Conversions * Internal or External Reference * Up to 88 Individually Programmable, Multiplexed GPIO Pins WithInput Filtering * JTAG Boundary Scan Support * Advanced Emulation Features * Analysis and Breakpoint Functions * Real-Time Debug via Hardware * Development Support Includes * ANSI C/C++ Compiler/Assembler/Linker * Code Composer Studio IDE * DSP/BIOS * Digital Motor Control and Digital Power Software Libraries * Low-Power Modes and Power Savings * IDLE, STANDBY, HALT Modes Supported * Disable Individual Peripheral Clocks * Endianness: Little Endian * Package Options: * Lead-free, Green Packaging * Low-Profile Quad Flatpack (PGF, PTP) * MicroStar BGA (ZHH) * Plastic BGA (ZJZ) * Temperature Options: * A: –40°C to 85°C (PGF, ZHH, ZJZ) * S: –40°C to 125°C (PTP, ZJZ) * Q: –40°C to 125°C (PTP, ZJZ)

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