TPA311D - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TPA311D
Manufacturer

TI
ChipWorker Part#

CW36273193
Category

Audio Amplifier IC
Package

SOIC-8
Description

TEXAS INSTRUMENTS TPA311D Audio Power Amplifier, AB, 1Channel, 350mW, 2.5V to 5.5V, SOIC, 8Pins
Documentation

Datasheet

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TPA311D Specifications

Attribute	Attribute Value

Part Number	TPA311D
Manufacturer	TI
ChipWorker Part#	CW36273193
Category	Audio Amplifier IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	SOIC-8
Supply Voltage (DC)	5.50 V
Supply Current	1.5 mA
Number of Channels	1 Channel
Number of Positions	8 Position
Power Dissipation	725 mW
Quiescent Current	700 µA
Gain Bandwidth Product	1.4 MHz
Output Power	350 mW
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	725 mW
Supply Voltage	2.5V ~ 5.5V
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Size-Length	4.9 mm
Size-Width	3.91 mm
Size-Height	1.58 mm
Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE _on the fly_ when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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