TPIC1021D - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TPIC1021D
Manufacturer

TI
ChipWorker Part#

CW74750896
Category

Interface IC, Interface Controller
Package

SOIC-8
Description

Automotive Catalog LIN Physical Interface 8-SOIC -40℃ to 125℃
Documentation

Datasheet

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TPIC1021D Specifications

Attribute	Attribute Value

Part Number	TPIC1021D
Manufacturer	TI
ChipWorker Part#	CW74750896
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	SOIC-8
Supply Voltage (DC)	7.00V (min)
Output Voltage	5.5 V
Output Current	3.5 mA
Supply Current	1.2 mA
Number of Positions	8 Position
Bandwidth	20 kHz
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	7V ~ 27V
Supply Voltage (Max)	18 V
Supply Voltage (Min)	7 V
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Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

The TPIC1021D is a Local Interconnect Network Physical Interface integrates the serial transceiver with wake up and protection features. The LIN bus is a single wire, bi-directional bus typically used for low-speed in-vehicle networks using baud rates between 2.4 and 20kbps. The LIN bus has two logical values: the dominant state (voltage near ground) represents a logic 0 and the recessive state (voltage near battery) and represents logic 1. In the recessive state the LIN bus is pulled high by the TPIC1021"s internal pull-up resistor (30kR) and series diode, so no external pullup components are required for slave applications. Master applications require an external pullup resistor (1R) plus a series diode. The LIN protocol output data stream on the TXD pin is converted by the TPIC1021 into the LIN bus signal through a current limited, wave-shaping low-side driver with control as outlined by the LIN Physical Layer Specification Revision 2.0.
LIN physical layer specification revision 2.0
Low current consumption in low power mode
Wake-up available from LIN bus, wake-up input
Dominant state timeout protection on TXD pin
Wake-up request on RXD pin
Control of external voltage regulator (INH pin)
Integrated pull-up resistor and series diode for LIN slave applications
Low EME and high EMI
Bus terminal short-circuit protected for short-to-battery or short-to-ground
Thermally protected
Ground disconnection failsafe at system level
Ground shift operation at system level
Unpowered node does not disturb the network
Green product and no Sb/Br
Device has limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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