TPS65910A3A1RSL - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TPS65910A3A1RSL
Manufacturer

TI
ChipWorker Part#

CW8268596
Category

Power Management IC
Package

VQFN-48
Description

OMAP3 Power Management 2.7V to 5.5V 48Pin VQFN EP Tube
Documentation

Datasheet

TPS65910A3A1RSL Global Supplier

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TPS65910A3A1RSL Specifications

Attribute	Attribute Value

Part Number	TPS65910A3A1RSL
Manufacturer	TI
ChipWorker Part#	CW8268596
Category	Power Management IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	48 Pin
Case/Package	VQFN-48
Supply Voltage (DC)	5.50 V
Number of Outputs	11 Output
Output Current	20 mA
Number of Positions	48 Position
Number of Regulated Outputs	12 Output
Input Voltage (Max)	5.5 V
Input Voltage (Min)	2.7 V
Output Voltage (Max)	1.88 V
Output Voltage (Min)	1.78 V
Output Current (Max)	1.7 A
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	5.5 V
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Size-Length	6.15 mm
Size-Width	6.15 mm
Size-Height	0.95 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

The TPS65910A3A1RSL is an integrated Power Management IC dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell or 3-series Ni-MH cells or by a 5V input, it requires multiple power rails. The device provides three step-down converters, one step-up converter and eight LDOs and is designed to support the specific power requirements of OMAP-based applications. Two of the step-down converters provide power for dual processor cores and are controllable by a dedicated class-3 SmartReflex interface for optimum power savings. The third converter provides power for the I/Os and memory in the system. The device includes eight general-purpose LDOs providing a wide range of voltage and current capabilities. The LDOs are fully controllable by the I2C interface. In addition to the power resources, the device contains an embedded power controller (EPC) to manage the power sequencing requirements of the OMAP systems and an RTC.
Embedded power controller
SmartReflex compliant dynamic voltage management for processor cores
8 LDO voltage regulators and one real-time clock (RTC) LDO (internal purpose)
One high-speed I2C interface for general-purpose control commands (CTL-I2C)
One high-speed I2C interface for SmartReflex class 3 controls and command (SR-I2C)
Two enable signals multiplexed with SR-I2C
Thermal shutdown protection and hot-die detection
One configurable GPIO
DC-DC switching synchronization through internal or external 3MHz clock

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