TS5A23166YZPR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TS5A23166YZPR
Manufacturer

TI
ChipWorker Part#

CW29470733
Category

Analog Switch Ic, Analog Switch Multiplexer
Package

DSBGA-8
Description

0.9Ω Dual SPST Analog Switch 5V/3.3V 2Channel Analog Switch 8-DSBGA -40℃ to 85℃
Documentation

Datasheet

TS5A23166YZPR Global Supplier

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TS5A23166YZPR Specifications

Attribute	Attribute Value

Part Number	TS5A23166YZPR
Manufacturer	TI
ChipWorker Part#	CW29470733
Category	Analog Switch Ic, Analog Switch Multiplexer
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	DSBGA-8
Number of Outputs	2 Output
Contacts Type	SPST
Number of Circuits	2 Circuit
Number of Channels	2 Channel
Number of Positions	8 Position
Number of Bits	2 Bit
Voltage Nodes	1.80 V, 2.50 V, 3.00 V, 3.30 V, 5.00 V
Bandwidth	150 MHz
Number of Inputs	2 Input
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
3dB Bandwidth	150 MHz
Supply Voltage	1.65V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	1.65 V
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Size-Length	1.9 mm
Size-Width	0.9 mm
Size-Height	0.3 mm
Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

The TS5A23166YZPR is a single-pole single-throw (SPST) dual Analog Switch designed to operate from 1.65 to 5.5V. The TS5A23166 device offers a low on-state resistance and an excellent channel-to-channel on-state resistance matching. This device has excellent total harmonic distortion (THD) performance and consumes very low power.
Isolation in powered-down mode
Low on-state resistance
Low charge injection
Excellent ON-State Resistance Matching
Low Total Harmonic Distortion (THD)
Latch-up performance exceeds 100mA Per JESD 78, Class II
ESD performance tested per JESD 22
Green product and no Sb/Br
Device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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