TS951IN - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TS951IN
Manufacturer

ST Microelectronics
ChipWorker Part#

CW142359366
Category

Amplifier, Buffer IC
Package

DIP-8
Description

TS951 Series 12V 3MHz Rail-to-Rail Low-Power Operational Amplifier - DIP-8
Documentation

Datasheet

TS951IN Global Supplier

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TS951IN Specifications

Attribute	Attribute Value

Part Number	TS951IN
Manufacturer	ST Microelectronics
ChipWorker Part#	CW142359366
Category	Amplifier, Buffer IC
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	8 Pin
Case/Package	DIP-8
Supply Current	950 µA
Number of Circuits	1 Circuit
Bandwidth	3 MHz
Slew Rate	1.00 V/μs
Gain Bandwidth Product	3 MHz
Input Offset Voltage	6 mV
Input Bias Current	35 nA
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Gain Bandwidth	3 MHz
Supply Voltage	2.7V ~ 12V
Supply Voltage (Max)	12 V
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Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2014/06/16

Product Description

**Description**
The TS95x family are rail-to-rail BiCMOS operational amplifiers optimized and fully specified for 3V and 5V operation. The TS951 is housed in the space-saving 5 pins SOT23 package that makes it well suited for battery-powered systems. This micropackage simplifies the PC board design because of it’s ability to be placed in tight spaces (outside dimensions are: 2.8mm x 2.9mm)
■ Rail-to-rail input common-mode voltage range
■ Rail-to-rail output voltage swing
■ Operating from 2.7V to 12V
■ High-speed (3MHz, 1V/µs)
■ Low consumption (0.9mA @ 3V)
■ Supply voltage rejection ratio: 80dB
■ Latch-up immunity
■ Available in SOT23-5 micropackage
**Applications**
■ Set-top boxes
■ Laptop/notebook computers
■ Transformer/line drivers
■ Personal entertainments (CD players)
■ Portable communication (cell phones, pagers)
■ Instrumentation & sensoring
■ Digital to analog converter buffers
■ Portable headphone speaker drivers

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Ordering Information

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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