TXB0102YZPR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TXB0102YZPR
Manufacturer

TI
ChipWorker Part#

CW9169707
Category

Voltage Level Translator IC
Package

XFBGA-8
Description

2Bit Bidirectional Voltage-Level Shifter with Auto Direction Sensing and +/-15kV ESD Protect 8-DSBGA -40℃ to 85℃
Documentation

Datasheet

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TXB0102YZPR Specifications

Attribute	Attribute Value

Part Number	TXB0102YZPR
Manufacturer	TI
ChipWorker Part#	CW9169707
Category	Voltage Level Translator IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	XFBGA-8
Supply Voltage (DC)	1.20V (min)
Number of Circuits	1 Circuit
Number of Channels	2 Channel
Number of Positions	8 Position
Number of Bits	2 Bit
Data Rate	100 Mbps
Number of Inputs	2 Input
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Number of Output Channels	1 Channel
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	1.2 V
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Size-Height	0.31 mm
Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

DESCRIPTION/ORDERING INFORMATION
This 2-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
FEATURES
• Available in the Texas Instruments NanoFree™ Packages
• 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB)
• VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance
State
• OE Input Circuit Referenced to VCCA
• Low Power Consumption, 4-µA Max ICC
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 15-kV Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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