WL1835MODGBMOCT - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

WL1835MODGBMOCT
Manufacturer

TI
ChipWorker Part#

CW2405086
Category

RF Receiver
Package

SIP
Description

WLAN+BTCombo Module Chip IEEE 802.11B/g/n Bluetooth v4.0(BLE) + EDR 100Pin SIP SMD Module
Documentation

Datasheet

WL1835MODGBMOCT Global Supplier

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WL1835MODGBMOCT Specifications

Attribute	Attribute Value

Part Number	WL1835MODGBMOCT
Manufacturer	TI
ChipWorker Part#	CW2405086
Category	RF Receiver
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	100 Pin
Case/Package	SIP
Frequency	2.4 GHz
Output Power	17.3 dBm
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	-20 ℃
Supply Voltage	2.9V ~ 4.8V
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Size-Height	2 mm
Operating Temperature	-20℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	Compliant with Exemption
Lead-Free Status	Contains Lead
ECCN Code	5A992.c
HK STC License	NLR

Product Description

The WL1835MODGBMOCT is a 1-band Wi-Fi/Bluetooth Combo Module offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. The device is a 2.4GHz module, two antenna solution. It offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX and FreeRTOS, are supported through third parties. It is suitable for use with internet of things (IoT), smart gateway and metering, home electronics, video conferencing, home appliances and white goods, video camera and security applications.
Small form factor
Fully calibrated
Reduces design overhead
Quick hardware design with TI module
Dedicated audio processor support of SBC encoding+A2DP
Wi-Fi Direct concurrent operation (multichannel, multirole)
WLAN baseband processor and RF transceiver supports IEEE 802.11a, b, g and n
2.4GHz MRC Support for extended range
4-bit SDIO Host interface support

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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