3650JG ,Amplifier, Buffer IC - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Popularity Score

61 points

Part No

3650JG
Manufacturer

TI
ChipWorker Part#

CW143069313
Category

Amplifier, Buffer IC
Package

CDIP-32
Description

IC OPAMP ISO 15kHz SGL 32CDIP
Documentation

Datasheet
Ships from

Moscow
Наличие

6 pcs In Stock
Estimated Price

$ 348.24

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ChipWorker Qualifications — ISO 9001, ISO 45001, ISO 14001, MA Certification. Over 11 years of experience, more than 1000 clients in Russia, support for small MOQ

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3650JG Specifications

Consulting Engineer >>

Attribute	Attribute Value

Part Number	3650JG
Manufacturer	TI
ChipWorker Part#	CW143069313
Category	Amplifier, Buffer IC
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	32 Pin
Case/Package	CDIP-32
Supply Current	2.3 mA
Number of Circuits	1 Circuit
Number of Channels	1 Channel
Bandwidth	15 KHz
Slew Rate	1.20 V/μs
Input Offset Voltage	1 mV
Input Bias Current	10 nA
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	0 ℃
3dB Bandwidth	15 kHz
	expand all
Size-Length	44.7 mm
Size-Width	29.46 mm
Size-Height	5.84 mm
Operating Temperature	0℃ ~ 85℃
Product Lifecycle Status	Not Recommended for New Designs
Packaging	Tube
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

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- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing