C220-075-3AE ,Heatsinks, Heat Sink - Ohmite

The pictures are for reference only, and the specific specifications can be found in the product manual.

Popularity Score

60 points

Part No

C220-075-3AE
Manufacturer

Ohmite
ChipWorker Part#

CW12525430
Category

Heatsinks, Heat Sink
Package

TO-220
Description

Heat Sink, Square, Black Anodized, 3 Clips, T0-247 & T0-264, TO-220, 38mm, 19.94mm, 75mm
Documentation

Datasheet
Ships from

Moscow
Наличие

523 pcs In Stock
Estimated Price

$ 5.54

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Chipworker Certification

ChipWorker Qualifications — ISO 9001, ISO 45001, ISO 14001, MA Certification. Over 11 years of experience, more than 1000 clients in Russia, support for small MOQ

11+ years sourcing experience

1000+ russia customers

ISO certified supplier

Support small MOQ

*Photos of Our Actual 800 m² Warehouse

C220-075-3AE Specifications

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Attribute	Attribute Value

Part Number	C220-075-3AE
Manufacturer	Ohmite
ChipWorker Part#	CW12525430
Category	Heatsinks, Heat Sink
Documentation	Datasheet
Mounting Style	Through Hole
Case/Package	TO-220
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Size-Length	75.00 mm
Size-Width	19.94 mm
Size-Height	38 mm
Material	Aluminum
Weight	1.6 oz
Product Lifecycle Status	Active
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
HTS Code	7604291000
ECCN Code	EAR99

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Product Description

Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.*
Features:
* **Minimum assembly cost and labor Spring Clips make the mounting holes, fasteners, tools and fixtures obsolete in assembly operations & reduce costs**
* **Maximum Thermal Transfer Maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance**
* **Maximum Repeatability Constant spring force over repeated assembly/disassembly**
* **Maximum Reliability Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping**
* **Design Flexibility Maximum flexibility for dynamic device locations and power upgrading. “Configureto-Fit” gives designers total freedom to configure heat sink needed to fit into a multitude design environments

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
- You can check the status of your order in the “My Order” section of your personal account.
- Orders cannot be canceled after the package has been shipped. View more >
- Works with both individual and corporate clients. View more >
- All prices on the website include 22% VAT.
- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing