CC2560ARVMT - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

CC2560ARVMT
Manufacturer

TI
ChipWorker Part#

CW44338451
Category

Interface IC, Interface Controller
Package

VQFN-76
Description

Bluetooth 4Mbps 76Pin VQFN EP T/R
Documentation

Datasheet

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CC2560ARVMT Specifications

Attribute	Attribute Value

Part Number	CC2560ARVMT
Manufacturer	TI
ChipWorker Part#	CW44338451
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	76 Pin
Case/Package	VQFN-76
Frequency	2.4 GHz
Supply Voltage (DC)	2.20V (min)
Number of Positions	76 Position
Data Rate	4.00 Mbps
Output Power	12 dBm
Standby Current	40.0 µA
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	2.2V ~ 4.8V
Supply Voltage (Max)	4.8 V
Supply Voltage (Min)	2.2 V
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Size-Height	0.85 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Not Recommended for New Designs
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	5A992C
HK STC License	NLR

Product Description

* Single-Chip _Bluetooth_ Solution Integrating _Bluetooth_ Basic Rate (BR)/Enhanced Data Rate (EDR)/ Low Energy (LE) Features Fully Compliant with the _Bluetooth_ 4.0 Specification Up to the HCI Layer * BR/EDR Features Include: * Up to 7 Active Devices * Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves * Up to 2 SCO Links on the Same Piconet * Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded) * CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power * LE Features Include: * Support of Up to 10 (CC2564 and CC2564B) Simultaneous Connections * Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption * Independent Buffering for LE Allows Large Numbers of Multiple Connections without Affecting BR/EDR Performance. * Built-In Coexistence and Prioritization Handling for BR/EDR and LE * Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex™-M3 and Cortex™-M4 MCUs * Highly Optimized for Low-Cost Designs: * Single-Ended 50-Ω RF Interface * Package Footprint: 76 Terminals, 0.6-mm Pitch, 8.10-mm × 8.10-mm mrQFN * Best-in-Class _Bluetooth_ (RF) Performance (TX Power, RX Sensitivity, Blocking) * Class 1.5 TX Power Up to +12 dBm * Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required * Improved Adaptive Frequency Hopping (AFH) Algorithm with Minimum Adaptation Time * Provides Longer Range, Including 2xRange Over Other BLE-Only Solutions * ROM Spin to Enable Offload Host and Save Current with Assisted Audio (SBC Encode and Decode On Chip) * Advanced Power Management for Extended Battery Life and Ease of Design: * On-Chip Power Management, Including Direct Connection to Battery * Low Power Consumption for Active, Standby, and Scan _Bluetooth_ Modes * Shutdown and Sleep Modes to Minimize Power Consumption * Physical Interface: * Fully Programmable Digital PCM-I2S Codec Interface * CC256x Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack * Device Terminal-to-Terminal Compatible with Previous Devices or Modules

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