ISO7240CDW - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

ISO7240CDW
Manufacturer

TI
ChipWorker Part#

CW12234237
Category

Interface Isolator, Digital Isolator
Package

SOIC-16
Description

Digital Isolator, Quad, 4Channel, 51ns, 3.15V, 5.5V, SOIC, 16Pins
Documentation

Datasheet

ISO7240CDW Global Supplier

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ISO7240CDW Specifications

Attribute	Attribute Value

Part Number	ISO7240CDW
Manufacturer	TI
ChipWorker Part#	CW12234237
Category	Interface Isolator, Digital Isolator
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	16 Pin
Case/Package	SOIC-16
Supply Voltage (DC)	3.30 V, 5.00 V
Rise/Fall Time	2 ns
Supply Current	17.0 mA
Number of Channels	4 Channel
Number of Positions	16 Position
Power Dissipation	220 mW
Data Rate	25.0 Mbps
Rise Time	2 ns
Isolation Voltage	2500 Vrms
Thermal Shutdown	No
Input Current (Min)	10 μA
Maximum Forward Voltage (Max)	5 V
Fall Time (Max)	2 ns
Fall Time (Max)	2 ns
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	220 mW
Supply Voltage	3.15V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	3.15 V
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Size-Length	10.5 mm
Size-Width	2.65 mm
Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
ECCN Code	EAR99

Product Description

The ISO7240CDW is a quad-channel Digital Isolator with multiple channel configurations and output-enable functions. This device has logic-input and logic-output buffers separated by Texas Instrument"s silicon-dioxide (SiO2) isolation barrier. Used in conjunction with isolated power supplies, these devices help block high voltage, isolate grounds and prevent noise currents from entering the local ground and interfering with or damaging sensitive circuitry.
25 and 150Mbps Signalling
1ns Maximum low channel-to-channel output skew
2ns Maximum low pulse-width distortion (PWD)
1ns Typical at 150Mbps low jitter content
Green product and no Sb/Br
Device has limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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