LM3404HVMR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LM3404HVMR
Manufacturer

TI
ChipWorker Part#

CW64246041
Category

LED Driver, LED Display Driver
Package

SOIC-8
Description

1A Constant Current Buck Regulator for High Power LED Drivers 8-SO PowerPAD -40℃ to 125℃
Documentation

Datasheet

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LM3404HVMR Specifications

Attribute	Attribute Value

Part Number	LM3404HVMR
Manufacturer	TI
ChipWorker Part#	CW64246041
Category	LED Driver, LED Display Driver
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	SOIC-8
Frequency	1 MHz
Number of Outputs	1 Output
Output Voltage	73 V
Output Current	1.00 A
Forward Voltage	75 V
Number of Regulated Outputs	1 Output
Switching Frequency	1.00 MHz
Topology	Buck
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	75 V
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Size-Length	4.93 mm
Size-Width	3.94 mm
Size-Height	1.47 mm
Operating Temperature	-40℃ ~ 125℃ (TJ)
Product Lifecycle Status	Active
Packaging	Each
RoHS	Non-Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

The LM3404HVMR is a constant current Buck Regulator for high power LED driver, designed to deliver constant currents to high power LEDs. This regulator contains a high-side N-channel MOSFET switch with a current limit of 1.5A (typical) for step-down (buck) regulators. Hysteretic controlled on-time and an external resistor allow the converter output voltage to adjust as needed to deliver a constant current to series and series-parallel connected LED arrays of varying number and type. Some features of this product includes LED dimming using pulse width modulation (PWM), broken or open LED protection, low-power shutdown and thermal shutdown.
Cycle-by-cycle current limit
No control loop compensation required
Separate PWM dimming and low power shutdown
Supports all-ceramic output capacitors and capacitor-less outputs
Thermal shutdown protection
This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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