2SD2499 - Toshiba

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

2SD2499
Manufacturer

Toshiba
ChipWorker Part#

CW229297864
Category

Transistor
Package

TO-3
Description

TO-3P(HIS) NPN 600V 6mA
Documentation

Datasheet

2SD2499 Global Supplier

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2SD2499 Specifications

Attribute	Attribute Value

Part Number	2SD2499
Manufacturer	Toshiba
ChipWorker Part#	CW229297864
Category	Transistor
Documentation	Datasheet
Case/Package	TO-3
Polarity	NPN
Breakdown Voltage (Collector to Emitter)	600 V
Continuous Collector Current	6mA
	expand all
Product Lifecycle Status	Unknown
RoHS	RoHS Compliant

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Ordering Information

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
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- Orders cannot be canceled after the package has been shipped. View more >
- Works with both individual and corporate clients. View more >
- All prices on the website include 20% VAT.
- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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