C0805C100F5GACTU - KEMET Corporation

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

C0805C100F5GACTU
Manufacturer

KEMET Corporation
ChipWorker Part#

CW76944800
Category

Ceramic Capacitor
Package

0805
Description

SMD Multilayer Ceramic Capacitor, 0805 [2012 Metric], 10pF, 50V, ± 1%, C0G / NPO, C Series
Documentation

Datasheet

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C0805C100F5GACTU Specifications

Attribute	Attribute Value

Part Number	C0805C100F5GACTU
Manufacturer	KEMET Corporation
ChipWorker Part#	CW76944800
Category	Ceramic Capacitor
Documentation	Datasheet
Mounting Style	Surface Mount
Case/Package (SI)	2012
Case/Package	0805
Pin Pitch	0.75 mm
Voltage Rating (DC)	50.0 V
Insulation Resistance	100 GΩ
Capacitance	10 pF
Capacitance Tolerance	±1 %
Dielectric Characteristic	C0G/NP0
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-55 ℃
Voltage Rating	50 V
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Size-Length	2 mm
Size-Width	2 mm
Size-Height	0.78 mm
Dielectric Material	Ceramic
Operating Temperature	-55℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

The Kemet C series commercial grade multilayer ceramic chip capacitors is Class 1, C0G dielectric material which exhibits no change in capacitance with respect to time and voltage. There will be negligible change in capacitance with reference to ambient temperature. Standard end terminations use a nickel barrier layer and a matte tin finish to provide excellent soldering ability for customers. Typical applications include timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression and energy storage. MLCCs are monolithic devices that consist of laminated layers of specially formulated, ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated on the exposed ends of the chip to complete the connection.

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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