FODM8061 - Fairchild

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

FODM8061
Manufacturer

Fairchild
ChipWorker Part#

CW13780240
Category

Optocoupler, Optoisolator
Package

5-Mini-Flat
Description

High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler, 5LD,MFP (MINI FLAT PACKAGE),FULL-PITCH,WHITE COPLANAR, 3000/RAIL
Documentation

Datasheet

FODM8061 Global Supplier

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FODM8061 Specifications

Attribute	Attribute Value

Part Number	FODM8061
Manufacturer	Fairchild
ChipWorker Part#	CW13780240
Category	Optocoupler, Optoisolator
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	5 Pin
Case/Package	5-Mini-Flat
Rise/Fall Time	20ns, 10ns
Output Voltage	5.00 V
Output Current	0.05 A
Number of Channels	1 Channel
Number of Positions	5 Position
Forward Voltage	1.45 V
Input Current	15.0 mA
Power Dissipation	0.1 W
Data Rate	10.0 Mbps
Rise Time	0.02 µs
Isolation Voltage	3750 Vrms
Forward Current	50 mA
Input Current (Min)	50 mA
Reverse Breakdown Voltage	5 V
Maximum Forward Voltage (Max)	1.8 V
Forward Current (Max)	50 mA
Fall Time	0.01 µs
Operating Temperature (Max)	110 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	100 mW
Supply Voltage	3V ~ 5.5V
	expand all
Size-Height	2.11 mm
Operating Temperature	-40℃ ~ 110℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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