IRF9Z34NSPBF - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

IRF9Z34NSPBF
Manufacturer

Infineon
ChipWorker Part#

CW11731827
Category

MOSFET, MOSFET Transistor
Package

TO-263-3
Description

D2PAK P-CH 55V 19A
Documentation

Datasheet

IRF9Z34NSPBF Global Supplier

{{ supplierTable.supplier }}	{{ supplierTable.part }}	{{ supplierTable.availability }}	MOQ	{{ supplierTable.delivery_date }}

{{viewMore}}
{{viewMore}}
DigiKey	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
Arrow	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
Mouser	{{noList.partNo}} {{noList.mfr}}	0 {{ search_item }}	-	{{outStock}}
					{{submitRFQ}}

IRF9Z34NSPBF Specifications

Attribute	Attribute Value

Part Number	IRF9Z34NSPBF
Manufacturer	Infineon
ChipWorker Part#	CW11731827
Category	MOSFET, MOSFET Transistor
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	3 Pin
Case/Package	TO-263-3
Power Rating	68 W
Number of Channels	1 Channel
Number of Positions	3 Position
Drain to Source Resistance (on) (Rds)	0.1 Ω
Polarity	P-CH
Power Dissipation	68 W
Threshold Voltage	4 V
Drain to Source Voltage (Vds)	55 V
Breakdown Voltage (Drain to Source)	55 V
Continuous Drain Current (Ids)	19A
Rise Time	55 ns
Input Capacitance (Ciss)	620pF @25V(Vds)
Fall Time	41 ns
Operating Temperature (Max)	175 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	3.8W (Ta), 68W (Tc)
	expand all
Size-Length	10.67 mm
Size-Width	9.65 mm
Size-Height	4.83 mm
Material	Silicon
Operating Temperature	-55℃ ~ 175℃ (TJ)
Product Lifecycle Status	Not Recommended for New Designs
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/12/17

Product Description

The IRF9Z34NSPBF is a HEXFET® fifth generation single P-channel Power MOSFET utilizes advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient and reliable device. The surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible ON-resistance in any existing surface-mount package. It is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2W in a typical surface-mount application.
Advanced process technology
Fast switching
Fully avalanche rating
Low static drain-to-source ON-resistance
Dynamic dV/dt rating

expand all

Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
- You can check the status of your order in the “My Order” section of your personal account.
- Orders cannot be canceled after the package has been shipped. View more >
- Works with both individual and corporate clients. View more >
- All prices on the website include 20% VAT.
- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

Contact Us

Buy IRF9Z34NSPBF

Stock is limited and changes quickly. Our 24/7 online sales team is ready to respond to your inquiries and orders at any time.