LM158AH - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LM158AH
Manufacturer

TI
ChipWorker Part#

CW31302793
Category

Operational Amplifier, OP Amp IC
Package

TO-99-8
Description

OP Amp Dual GP ±16V/32V 8Pin TO-99 Box
Documentation

Datasheet

LM158AH Global Supplier

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LM158AH Specifications

Attribute	Attribute Value

Part Number	LM158AH
Manufacturer	TI
ChipWorker Part#	CW31302793
Category	Operational Amplifier, OP Amp IC
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	8 Pin
Case/Package	TO-99-8
Output Current	40mA @15V
Supply Current	1 mA
Number of Circuits	2 Circuit
Number of Channels	2 Channel
Power Dissipation	0.55 W
Common Mode Rejection Ratio	70 dB
Input Offset Drift	7.00 µV/K
Slew Rate	500 mV/μs
Gain Bandwidth Product	1 MHz
Input Offset Voltage	2 mV
Input Bias Current	50 nA
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-55 ℃
Gain Bandwidth	1 MHz
Power Dissipation (Max)	550 mW
Minimum CMRR Range	70 dB
Supply Voltage (Max)	32 V
Supply Voltage (Min)	3 V
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Operating Temperature	-55℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Box
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

Product Description

**Description**
The LM158 series consists of two independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage.
Application areas include transducer amplifiers, dc gain blocks and all the conventional op-amp circuits which now can be more easily implemented in single power supply systems. For example, the LM158 series can be directly operated off of the standard 3.3-V power supply voltage which is used in digital systems and will easily provide the required interface electronics without requiring the additional ±15V power supplies. The LM358 and LM2904 are available in a chip sized package (8-Bump DSBGA) using TI"s DSBGA package technology.

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