M29W128GH70ZS3E - Micron

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

M29W128GH70ZS3E
Manufacturer

Micron
ChipWorker Part#

CW160497509
Category

Memory Chip
Package

FBGA-64
Description

NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8Bit/16Bit 70ns 64Pin FBGA Tray
Documentation

Datasheet

M29W128GH70ZS3E Global Supplier

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M29W128GH70ZS3E Specifications

Attribute	Attribute Value

Part Number	M29W128GH70ZS3E
Manufacturer	Micron
ChipWorker Part#	CW160497509
Category	Memory Chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	64 Pin
Case/Package	FBGA-64
Supply Current	10 mA
Number of Bits	8, 16 Bit
Access Time	70 ns
Access Time(Max)	70 ns
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	2.7V ~ 3.6V
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Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status
ECCN Code	3A991.b.1.a

Product Description

FLASH - NOR Memory IC 128Mb (16M x 8, 8M x 16) Parallel 70ns 64-FBGA (11x13)

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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