NSS40600CF8T1G - ON Semiconductor

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

NSS40600CF8T1G
Manufacturer

ON Semiconductor
ChipWorker Part#

CW69212196
Category

BJT Transistor, BJT
Package

SMD-8
Description

Chip PNP 40V 6A
Documentation

Datasheet

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NSS40600CF8T1G Specifications

Attribute	Attribute Value

Part Number	NSS40600CF8T1G
Manufacturer	ON Semiconductor
ChipWorker Part#	CW69212196
Category	BJT Transistor, BJT
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package (SI)	3216
Case/Package	SMD-8
Frequency	100 MHz
Halogen Free Status	Halogen Free
Polarity	PNP
Power Dissipation	2.75 W
Breakdown Voltage (Collector to Emitter)	40 V
Continuous Collector Current	6A
hFE Min	220 @1A, 2V
Input Power (Max)	830 mW
DC Current Gain (hFE)	300
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	1400 mW
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Size-Length	3.2 mm
Size-Width	1.65 mm
Material	Silicon
Operating Temperature	-55℃ ~ 150℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

ON Semiconductor offers the latest in low-profile, small-outline packaging. We enable the design and production of ultra-thin end-user products for the consumer market, by manufacturing some of the lowest profile packaging available in the world, in vast volumes. Whether you are designing mobile phones, MP3 players, digital still cameras, PDAs, game players, or other portable appliances, our packaging technology allows the ON Semiconductor product portfolio to be used in designs with the most demanding space constraints.
All of our packages are available with Pb-free leads to ensure compliance with RoHS standards.

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- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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