NUF2441FCT1G - ON Semiconductor

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

NUF2441FCT1G
Manufacturer

ON Semiconductor
ChipWorker Part#

CW13086667
Category

RFI Shielding
Package

Flip-Chip-6
Description

LC (Pi) EMI Filter 3rd Order Low Pass 2Channel L = 2.9nH, C = 250pF 6-WFBGA, FCBGA
Documentation

Datasheet

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NUF2441FCT1G Specifications

Attribute	Attribute Value

Part Number	NUF2441FCT1G
Manufacturer	ON Semiconductor
ChipWorker Part#	CW13086667
Category	RFI Shielding
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	Flip-Chip-6
Voltage Rating (DC)	12.0 V
Capacitance	250 pF
Halogen Free Status	Halogen Free
Breakdown Voltage	13.7 V
Number of Channels	2 Channel
Number of Positions	6 Position
Shielding	No
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
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Size-Length	1.72 mm
Size-Width	1.22 mm
Size-Height	0.7 mm
Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an intergrated solution in a small package reducing PCB space and cost.
Features
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Provides EMI Filtering and ESD Protection
Single IC Offers Cost Saving by Replacing 2 Inductors, 4 Capacitors, and 4 TVs diodes
Compliance with IEC61000-4-2, (Level 4) 8kV (Contact), 15kV (air)
Flip-Chip Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C, Human Body Model = 3B
Pb-Free Solder Bumps

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