OMAP3503DCBB - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OMAP3503DCBB
Manufacturer

TI
ChipWorker Part#

CW94947978
Category

Microprocessor IC
Package

FCBGA-515
Description

IC MPU OMAP-35XX 600MHz 515FCBGA
Documentation

Datasheet

OMAP3503DCBB Global Supplier

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OMAP3503DCBB Specifications

Attribute	Attribute Value

Part Number	OMAP3503DCBB
Manufacturer	TI
ChipWorker Part#	CW94947978
Category	Microprocessor IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	515 Pin
Case/Package	FCBGA-515
Supply Voltage (DC)	1.35V (max)
Clock Speed	600 MHz
RAM Memory Size	64 KB
Number of Bits	32 Bit
Number of UARTs	3 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage (Max)	1.35 V
	expand all
Operating Temperature	0℃ ~ 90℃ (TJ)
Product Lifecycle Status	Obsolete
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
HK STC License	NLR

Product Description

Description
OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
• Streaming video
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
• Linux®
• Windows® CE
• Android™
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
• A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC
packages only)

expand all

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Ordering Information

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- Please check the technical specifications of the products when ordering.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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