SPC5777CCK3MME3 - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SPC5777CCK3MME3
Manufacturer

NXP
ChipWorker Part#

CW98396135
Category

Microcontroller, MCU IC
Package

BGA-416
Description

MCU 32Bit e200z7 RISC 8Mb Flash 3.3V/5V Automotive 416Pin MAP-BGA Tray
Documentation

Datasheet

SPC5777CCK3MME3 Global Supplier

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SPC5777CCK3MME3 Specifications

Attribute	Attribute Value

Part Number	SPC5777CCK3MME3
Manufacturer	NXP
ChipWorker Part#	CW98396135
Category	Microcontroller, MCU IC
Documentation	Datasheet
Number of Pins	416 Pin
Case/Package	BGA-416
Number of Positions	416 Position
RAM Memory Size	512 KB
Power Dissipation	1600 mW
Number of ADCs	4 ADC
Number of Inputs and Outputs	283 Input IO
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	1600 mW
Supply Voltage (Max)	1.32 V
Supply Voltage (Min)	1.2 V
	expand all
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	5A992

Product Description

Overview
The MPC5777C Power Architecture® MCU targets industrial and automotive engine control applications that require advanced performance, timing systems, security and functional safety capabilities. The family offers a high performance multi-core architecture with industry standard eTPU based timer system. A Flash offering that supports code expansion, a security module and packaging options are available along with the highest level of functional safety (ASIL-D) support.
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## Features
* Two independent 264MHz Power Architecture® z7 cores
* Single 264MHz z7 core in Lockstep with one of the main cores
* 8M Flash
* 512kB total SRAM
* 3 eTPU2 timers with 96 channels
* eMIOS timer with 32 channels
* Ethernet 10/100
* 4 Sigma Delta and 4 eQADC converters
* Built to support functional safety (ISO 26262/ASIL-D)
* 416 and 516 BGA
* -40 to 125C Ta Operation
## Features

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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