TDA1308T - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TDA1308T
Manufacturer

NXP
ChipWorker Part#

CW69784482
Package

TT
Description

IC 0.04W, 2Channel, AUDIO AMPLIFIER, PDSO8, 3.9MM, PLASTIC, MS-012, SOT-96-1, SOP-8, Audio/Video Amplifier
Documentation

Datasheet

TDA1308T Global Supplier

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TDA1308T Specifications

Attribute	Attribute Value

Part Number	TDA1308T
Manufacturer	NXP
ChipWorker Part#	CW69784482
Documentation	Datasheet
Mounting Style	Surface Mount
Case/Package	TT
	expand all
Product Lifecycle Status	Unknown
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1µm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications.
Features
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
High signal-to-noise ratio
High slew rate
Low distortion
Large output voltage swing

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Delivery

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Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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