TLE7231G - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TLE7231G
Manufacturer

Infineon
ChipWorker Part#

CW74234089
Category

Power Management IC
Package

PG-DSO-14
Description

Buffer/Inverter Based Peripheral Driver, 4 Driver, 0.5A, PDSO14, GREEN, PLASTIC, SOP-14
Documentation

Datasheet

TLE7231G Global Supplier

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TLE7231G Specifications

Attribute	Attribute Value

Part Number	TLE7231G
Manufacturer	Infineon
ChipWorker Part#	CW74234089
Category	Power Management IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	14 Pin
Case/Package	PG-DSO-14
Supply Voltage (DC)	3.00V (min)
Number of Outputs	4 Output
Output Current	340 mA
Supply Current	5 mA
Number of Positions	14 Position
Output Current (Max)	320 mA
Output Current (Min)	0.32 A
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	3 V
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Size-Length	8.75 mm
Size-Width	4 mm
Size-Height	1.47 mm
Operating Temperature	-40℃ ~ 150℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The TLE7231G is a 4-channel low-side SPI Driver for enhanced relay control providing embedded protective function. The 8-bit serial peripheral interface (SPI) is provided for control and diagnostics of the device and the loads and also for daisy-chain capability. This is equipped with an input pin that can be individually routed to the output control of each channel and therefore offer complete flexibility in design and PCB layout. The input multiplexer is controlled via SPI. The device provides many diagnostics of the load enabling both open load and short-circuit detection. The SPI diagnostic bits indicate any eventual latched fault condition.
Very wide range for digital supply voltage
An input pin provides flexible and straight forward PWM operation
Stable behaviour at under-voltage
Less microcontroller I/Os needed
Protection of load and device
Reduced PCB space
Improved reliability
Less external components

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