TMS320F2811PBKS - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

TMS320F2811PBKS
Manufacturer

TI
ChipWorker Part#

CW54737396
Category

Microcontroller, MCU IC
Package

LQFP-128
Description

DSP Fixed-Point 32Bit 150MHz 150MIPS 128Pin LQFP
Documentation

Datasheet

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TMS320F2811PBKS Specifications

Attribute	Attribute Value

Part Number	TMS320F2811PBKS
Manufacturer	TI
ChipWorker Part#	CW54737396
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	128 Pin
Case/Package	LQFP-128
Frequency	150 MHz
Clock Speed	150 MHz
RAM Memory Size	18K x 16
FLASH Memory Size	262144 B
Number of UARTs	2 UART
Number of ADCs	1 ADC
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
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Operating Temperature	-40℃ ~ 125℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	3A991.a.2

Product Description

Introduction
This section provides a summary of each device’s features, lists the pin assignments, and describes the function of each pin. This document also provides detailed descriptions of peripherals, electrical specifications, parameter measurement information, and mechanical data about the available packaging.
Features
• High-Performance Static CMOS Technology
– 150 MHz (6.67-ns Cycle Time)
– Low-Power (1.8-V Core at 135 MHz, 1.9-V Core at 150 MHz, 3.3-V I/O) Design
• JTAG Boundary Scan Support(1)
• High-Performance 32-Bit CPU ( TMS320C28x™)
– 16 x 16 and 32 x 32 MAC Operations
– 16 x 16 Dual MAC
– Harvard Bus Architecture
– Atomic Operations
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– 4M Linear Program/Data Address Reach
– Code-Efficient (in C/C++ and Assembly)
– TMS320F24x/LF240x Processor Source Code Compatible
• On-Chip Memory
– Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors)
– ROM Devices: Up to 128K x 16 ROM
– 1K x 16 OTP ROM
– L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM)
– H0: 1 Block of 8K x 16 SARAM
– M0 and M1: 2 Blocks of 1K x 16 Each SARAM
• Boot ROM (4K x 16)
– With Software Boot Modes
– Standard Math Tables
• External Interface (2812)
– Over 1M x 16 Total Memory
– Programmable Wait States
– Programmable Read/Write Strobe Timing
– Three Individual Chip Selects
• Endianness: Little Endian
• Clock and System Control
– Dynamic PLL Ratio Changes Supported
– On-Chip Oscillator
– Watchdog Timer Module
• Three External Interrupts
• Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts
• Three 32-Bit CPU-Timers
• 128-Bit Security Key/Lock
– Protects Flash/ROM/OTP and L0/L1 SARAM
– Prevents Firmware Reverse-Engineering
• Motor Control Peripherals
– Two Event Managers (EVA, EVB)
– Compatible to 240xA Devices
• Serial Port Peripherals
– Serial Peripheral Interface (SPI)
– Two Serial Communications Interfaces (SCIs), Standard UART
– Enhanced Controller Area Network (eCAN)
– Multichannel Buffered Serial Port (McBSP)
• 12-Bit ADC, 16 Channels
– 2 x 8 Channel Input Multiplexer
– Two Sample-and-Hold
– Single/Simultaneous Conversions
– Fast Conversion Rate: 80 ns/12.5 MSPS
• Up to 56 General-Purpose I/O (GPIO) Pins
• Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug via Hardware
• Development Tools Include
– ANSI C/C++ Compiler/Assembler/Linker
– Code Composer Studio™ IDE
– DSP/BIOS™
– JTAG Scan Controllers(1)
• Low-Power Modes and Power Savings
– IDLE, STANDBY, HALT Modes Supported
– Disable Individual Peripheral Clocks

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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