AM3703 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Popularity Score

17 points

Part No

AM3703
Manufacturer

TI
ChipWorker Part#

CW486730993
Package

FCBGA-515
Description

Sitara ARM Microprocessor (MPU)
Documentation

Datasheet
Ships from

Moscow
Наличие

In Stock
Estimated Price

Price on Request

Buy AM3703

Stock is limited and changes quickly. Our 24/7 online sales team is ready to respond to your inquiries and orders at any time.

Real stock check

Best price from distributors

Engineer support

AM3703 Global Supplier

{{ supplierTable.supplier }}	{{ supplierTable.part }}	{{ supplierTable.availability }}	MOQ	{{ supplierTable.delivery_date }}

{{viewMore}}
{{viewMore}}
DigiKey	{{noList.partNo}} {{noList.mfr}}	{{ low_stock_text }}	1	{{weeks_text}}
Arrow	{{noList.partNo}} {{noList.mfr}}	{{ low_stock_text }}	1	{{weeks_text}}
Mouser	{{noList.partNo}} {{noList.mfr}}	{{ low_stock_text }}	1	{{weeks_text}}
					{{submitRFQ}}
Chipworker	{{noList.partNo}} {{noList.mfr}}	{{stockAvailability}} {{ search_item }}	{{moq}}	1	6 - 8 {{delivery_date}}

Update Data

Chipworker Certification

ChipWorker Qualifications — ISO 9001, ISO 45001, ISO 14001, MA Certification. Over 11 years of experience, more than 1000 clients in Russia, support for small MOQ

11+ years sourcing experience

1000+ russia customers

ISO certified supplier

Support small MOQ

*Photos of Our Actual 800 m² Warehouse

AM3703 Specifications

Consulting Engineer >>

Attribute	Attribute Value

Part Number	AM3703
Manufacturer	TI
ChipWorker Part#	CW486730993
Documentation	Datasheet
Case/Package	FCBGA-515
	expand all
Product Lifecycle Status
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Similar & Replacement Parts

Product Description

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI"s advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.
The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.
The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.
The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:
A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
The clock specifications: input and output clocks, DPLL and DLL
A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
AM3715, AM3703 Sitara ARM Microprocessors:
Compatible to OMAP™ 3 Architecture
MPU Subsystem
Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
NEON SIMD Coprocessor
POWERVR SGX™ Graphics Accelerator (AM3715 only)
Tile Based Architecture Delivering up to 20 MPoly/sec
Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
Fine Grained Task Switching, Load Balancing, and Power Management
Programmable High Quality Image Anti-Aliasing
External Memory Interfaces:
SDRAM Controller (SDRC)
16, 32-bit Memory Controller With 1G-Byte Total Address Space
Interfaces to Low-Power SDRAM
SDRAM Memory Scheduler (SMS) and Rotation Engine
General Purpose Memory Controller (GPMC)
16-bit Wide Multiplexed Address/Data Bus
Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)
POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

expand all

Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
- You can check the status of your order in the “My Order” section of your personal account.
- Orders cannot be canceled after the package has been shipped. View more >
- Works with both individual and corporate clients. View more >
- All prices on the website include 22% VAT.
- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing