CC2540F128RHAR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

CC2540F128RHAR
Manufacturer

TI
ChipWorker Part#

CW28114440
Category

RF Module
Package

VQFN-40
Description

Bluetooth Class II 2507MHz 1Mbps SMART SOC w/USB 40Pin VQFN EP T/R
Documentation

Datasheet

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CC2540F128RHAR Specifications

Attribute	Attribute Value

Part Number	CC2540F128RHAR
Manufacturer	TI
ChipWorker Part#	CW28114440
Category	RF Module
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	40 Pin
Case/Package	VQFN-40
Frequency	2.4 GHz
Supply Voltage (DC)	2.00V (min)
Supply Current	0.0004 mA
Number of Positions	40 Position
Clock Speed	32.0 MHz
RAM Memory Size	8192 B
Data Rate	1.00 Mbps
FLASH Memory Size	131334144 B
Output Power	4 dBm
Number of UARTs	1 UART
Standby Current	400 nA
Antenna Connection	Differential
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	2V ~ 3.6V
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	2 V
	expand all
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
HK STC License	NLR

Product Description

DESCRIPTION
The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540 combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption.
FEATURES
• True Single-Chip BLE Solution: CC2540 Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, Etc.
• 6-mm × 6-mm Package
• RF
– Bluetooth low energy technology Compatible
– Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End
– Accurate Digital Received Signal-Strength Indicator (RSSI)
– Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
• Layout
– Few External Components
– Reference Design Provided
– 6-mm × 6-mm QFN40 Package
• Low Power
– Active Mode RX Down to 19.6 mA
– Active Mode TX (–6 dBm): 24 mA
– Power Mode 1 (3-μs Wake-Up): 235 μA
– Power Mode 2 (Sleep Timer On): 0.9 μA
– Power Mode 3 (External Interrupts): 0.4 μA
– Wide Supply Voltage Range (2 V–3.6 V)
– Full RAM and Register Retention in All Power Modes
• TPS62730 Compatible
Low Power in Active Mode
– RX Down to 15.8 mA (3 V Supply)
– TX (-6 dBm): 18.6 mA (3 V Supply)
• Microcontroller
– High-Performance and Low-Power 8051 Microcontroller Core
– In-System-Programmable Flash, 128 KB or 256 KB
– 8-KB SRAM
• Peripherals
– 12-Bit ADC with Eight Channels and Configurable Resolution
– Integrated High-Performance Op-Amp and Ultralow-Power Comparator
– General-Purpose Timers (One 16-Bit, Two 8-Bit)
– 21 General-Purpose I/O Pins (19× 4 mA, 2×20 mA)
– 32-kHz Sleep Timer With Capture
– Two Powerful USARTs With Support for Several Serial Protocols
– Full-Speed USB Interface
– IR Generation Circuitry
– Powerful Five-Channel DMA
– AES Security Coprocessor
– Battery Monitor and Temperature Sensor
– Each CC2540 Contains a Unique 48-bit IEEE Address
APPLICATIONS
• 2.4-GHz Bluetooth low energy Systems
• Mobile Phone Accessories
• Sports and Leisure Equipment
• Consumer Electronics
• Human Interface Devices (Keyboard, Mouse, Remote Control)
• USB Dongles
• Health Care and Medical

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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