HMC814 - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC814
Manufacturer

ADI
ChipWorker Part#

CW3111688
Category

RF Module, IC, Accessory
Package

Die
Description

ANALOG DEVICES HMC814 RF Frequency Multiplier IC, Single 5V/88mA, 13GHz to 24.6GHz, HQFN-12
Documentation

Datasheet

HMC814 Global Supplier

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HMC814 Specifications

Attribute	Attribute Value

Part Number	HMC814
Manufacturer	ADI
ChipWorker Part#	CW3111688
Category	RF Module, IC, Accessory
Documentation	Datasheet
Number of Pins	4 Pin
Case/Package	Die
Frequency	13GHz ~ 24.6GHz
Supply Voltage (DC)	4.50V (min)
Power Dissipation	782 mW
Output Power	17 dBm
Input Power (Max)	6 dBm
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	782 mW
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Operating Temperature	-55℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

High Output Power: +17 dBm Low Input Power Drive: 0 to +6 dBm Fo Isolation: >20 dBc @ Fout = 19 GHz 100 kHz SSB Phase Noise: -136 dBc/Hz Single Supply: +5V @ 88mA Die Size: 1.2 x 1.23 x 0.1 mm

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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