LPC804M101JHI33Y - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LPC804M101JHI33Y
Manufacturer

NXP
ChipWorker Part#

CW373263810
Package

HVQFN-33
Description

LPC804M101JHI33/HVQFN32///REEL 13 Q1/T1 *STANDARD
Documentation

Datasheet

LPC804M101JHI33Y Global Supplier

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LPC804M101JHI33Y Specifications

Attribute	Attribute Value

Part Number	LPC804M101JHI33Y
Manufacturer	NXP
ChipWorker Part#	CW373263810
Documentation	Datasheet
Number of Pins	32 Pin
Case/Package	HVQFN-33
RAM Memory Size	4 KB
Number of ADCs	1 ADC
Operating Temperature (Max)	105 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	930 mW
Number of DACs	1 DAC
	expand all
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant

Product Description

ARM® Cortex®-M0+ series Microcontroller IC 32-Bit 15MHz 32KB (32K x 8) FLASH 32-HVQFN (5x5)

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Pre-Shipment Inspection (PSI) will be used when ordering.
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- Invoices are issued in the currency specified, but payment is made in Russian rubles at the exchange rate on the day of payment.
- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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