LSM330 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LSM330
Manufacturer

ST Microelectronics
ChipWorker Part#

CW383487822
Description

3D Accelerometer and 3D Gyroscope 24Pin LGA Tray
Documentation

Datasheet

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LSM330 Specifications

Attribute	Attribute Value

Part Number	LSM330
Manufacturer	ST Microelectronics
ChipWorker Part#	CW383487822
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	24 Pin
Case/Package	TFLGA
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	Compliant with Exemption
HK STC License	NLR

Product Description

The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330 has a user-selectable full-scale acceleration range of ±2/±4/±6/±8/±16 g and an angular rate range of ±250/±500/±2000 dps. The accelerometer and gyroscope sensors can be either activated or separately put in power-down / sleep mode for applications optimized for power saving.
The LSM330 is available in a plastic land grid array (LGA) package.
**Key Features**
Analog supply voltage: 2.4 V to 3.6 V
Digital supply voltage IOs: 1.8 V
Power-down and sleep modes
2 embedded programmable state machines
3 independent acceleration channels and 3 angular rate channels
±2/±4/±6/±8/±16 g selectable full scale
±250/±500/±2000 dps selectable full scale
SPI/I2 C serial interface
Embedded temperature sensor
Embedded FIFO
ECOPACK® RoHS and “Green” compliant

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