LSM6DS3 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

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106 points

Part No

LSM6DS3
Manufacturer

ST Microelectronics
ChipWorker Part#

CW14000323
Package

LGA-14L
Description

INEMO Inertial Module Digital Output 1.8V/2.5V/3.3V 14Pin LGA Tray
Documentation

Datasheet
Ships from

Moscow
Наличие

In Stock
Estimated Price

$ 0.6

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LSM6DS3 Specifications

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Attribute	Attribute Value

Part Number	LSM6DS3
Manufacturer	ST Microelectronics
ChipWorker Part#	CW14000323
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	14 Pin
Case/Package	LGA-14L
Supply Current	0.7 mA
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Input Voltage	1.71.3.6 V
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Size-Length	2.5 mm
Size-Width	3 mm
Size-Height	0.86 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tray
RoHS	Compliant with Exemption
Lead-Free Status	Lead Free
ECCN Code	EAR99
HK STC License	NLR

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Product Description

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.
**Key Features**
Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Smart FIFO up to 8 kbyte based on features set
Compliant with Android K and L
Hard, soft ironing for external magnetic sensor corrections
±2/±4/±8/±16 g full scale
±125/±250/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I2 C serial interface with main processor data synchronization feature
Embedded temperature sensor
ECOPACK® , RoHS and “Green” compliant

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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