MN3207 - Panasonic

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MN3207
Manufacturer

Panasonic
ChipWorker Part#

CW327318764
Category

Active Chip
Package

DIP
Description

1024-Stage Low Voltage Operation, Low Noise BBD for Analog Signal Delays
Documentation

Datasheet

MN3207 Global Supplier

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MN3207 Specifications

Attribute	Attribute Value

Part Number	MN3207
Manufacturer	Panasonic
ChipWorker Part#	CW327318764
Category	Active Chip
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	14 Pin
Case/Package	DIP
Supply Voltage (DC)	5.00 V
	expand all
Product Lifecycle Status	Unknown
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead

Product Description

1024-Stage Low Voltage Operation, Low Noise BBD for Analog Signal Delays

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Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
- If you have special ordering instructions, please indicate them on the order page.
- Pre-Shipment Inspection (PSI) will be used when ordering.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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