SPC560B50L3B4E0X - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SPC560B50L3B4E0X
Manufacturer

ST Microelectronics
ChipWorker Part#

CW140590384
Category

Microcontroller, MCU IC
Package

LQFP-100
Description

MCU 32Bit SPC560B50x e200 RISC 512KB Flash 3.3V/5V Automotive 100Pin LQFP T/R
Documentation

Datasheet

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SPC560B50L3B4E0X Specifications

Attribute	Attribute Value

Part Number	SPC560B50L3B4E0X
Manufacturer	ST Microelectronics
ChipWorker Part#	CW140590384
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	100 Pin
Case/Package	LQFP-100
RAM Memory Size	32 KB
Number of ADCs	1 ADC
Operating Temperature (Max)	105 ℃
Operating Temperature (Min)	-40 ℃
	expand all
Operating Temperature	-40℃ ~ 105℃ (TA)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status
ECCN Code	3A991

Product Description

The SPC560B40x/50x and SPC560C40x/50x is a family of next generation microcontrollers built on the Power Architecture embedded category. The SPC560B40x/50x and SPC560C40x/50x family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of body electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.
**Key Features**
High-performance 64 MHz e200z0h CPU
32-bit Power Architecture® technology
Up to 60 DMIPs operation
Variable length encoding (VLE)
Memory
Up to 512 KB Code Flash with ECC
64 KB Data Flash with ECC
Up to 48 KB SRAM with ECC
8-entry memory protection unit (MPU)
Interrupts
16 priority levels
Non-maskable interrupt (NMI)
Up to 34 external interrupts incl. 18 wakeup lines
GPIO: 45(LQFP64), 75(LQFP100), 123(LQFP144)
Timer units
6-channel 32-bit periodic interrupt timers
4-channel 32-bit system timer module
Software watchdog timer
Real-time clock timer
16-bit counter time-triggered I/Os
Up to 56 channels with PWM/MC/IC/OC
ADC diagnostic via CTU
Communications interface
Up to 6 FlexCAN interfaces (2.0B active) with 64-message objects each
Up to 4 LINFlex/UART
3 DSPI / I2C
Single 5 V or 3.3 V supply
10-bit analog-to-digital converter (ADC) with up to 36 channels
Extendable to 64 channels via external multiplexing
Individual conversion registers
Cross triggering unit (CTU)
Dedicated diagnostic module for lighting
Advanced PWM generation
Time-triggered diagnostic
PWM-synchronized ADC measurements
Clock generation
4 to 16 MHz fast external crystal oscillator (FXOSC)
32 kHz slow external crystal oscillator (SXOSC)
16 MHz fast internal RC oscillator (FIRC)
128 kHz slow internal RC oscillator (SIRC)
Software-controlled FMPLL
Clock monitor unit (CMU)
Exhaustive debugging capability
Nexus1 on all devices
Nexus2+ available on emulation package (LBGA208)
Low power capabilities
Ultra-low power standby with RTC, SRAM and CAN monitoring
Fast wakeup schemes
Operating temp. range up to -40 to 125 °C

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