UES1106 - Microsemi

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

UES1106
Manufacturer

Microsemi
ChipWorker Part#

CW42236729
Category

Power Diode
Package

A, Axial
Description

Diode Switching 400V 2A 2Pin Case A
Documentation

Datasheet

UES1106 Global Supplier

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UES1106 Specifications

Attribute	Attribute Value

Part Number	UES1106
Manufacturer	Microsemi
ChipWorker Part#	CW42236729
Category	Power Diode
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	2 Pin
Case/Package	A, Axial
Forward Voltage	1.25 V
Thermal Resistance	38 ℃/W
Reverse recovery time	50 ns
Forward Current	2000 mA
Forward Current (Max)	2000 mA
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	2500 mW
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Product Lifecycle Status	Active
Packaging	Bulk
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

Product Description

2A, 400V Surface Mount Ultra-fast Rectifier
* * *

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Delivery

DHLPrice

UPS

FedEx

TNT

EMS

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SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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