CC2564MODNCMOET - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

CC2564MODNCMOET
Manufacturer

TI
ChipWorker Part#

CW6171065
Category

Interface IC, Interface Controller
Package

SMD-33
Description

BLUETOOTH, VERSION4.1, 2402-2480MHz; Data Rate:4Mbps; RF IC Case Style:-; Supply Voltage Min:2.2V; Supply Voltage Max:4.8V; Operating Temperature Min:-20℃; Operating Temperature Max:70℃; Packaging:Each; MSL:MSL 3 - 168 hours; ;RoHS Compliant: Yes
Documentation

Datasheet

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CC2564MODNCMOET Specifications

Attribute	Attribute Value

Part Number	CC2564MODNCMOET
Manufacturer	TI
ChipWorker Part#	CW6171065
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	33 Pin
Case/Package	SMD-33
Frequency	2.4 GHz
Supply Voltage (DC)	2.20V (min)
Clock Speed	2.40 GHz
Data Rate	4.00 Mbps
Output Power	10 dBm
Standby Current	40.0 µA
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	-20 ℃
Supply Voltage	2.2V ~ 4.8V
Supply Voltage (Max)	4.8 V
Supply Voltage (Min)	2.2 V
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Operating Temperature	-30℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	Non-Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	5A992C
HK STC License	NLR

Product Description

The CC2564MODN TI Bluetooth HCI module is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI"s seventh-generation Bluetooth core, the HCI module provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), the HCI module provides best-in-class RF performance. TI"s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions.
Single-Chip Solution Integrating Bluetooth Basic Rate/Enhanced Data Rate/Low Energy Features
Bluetooth 4.1 Compliant Up - Improved Adaptive Frequency Hopping (AFH) to the HCI Layer
Assisted Mode for HFP 1.6 Wideband Speech
Profile or A2DP Profile to Reduce Host Processing and Power
Advanced Power Management
Supports Class 1.5 Applications
Supports Maximum Bluetooth Data Rates Over HCI UART Interface

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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