H11D1M - Fairchild

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

H11D1M
Manufacturer

Fairchild
ChipWorker Part#

CW70228536
Category

Optocoupler, Optoisolator
Package

DIP-6
Description

DIP6 Through Hole Single Channel 300V 7500Vrms Phototransistor Optocoupler
Documentation

Datasheet

H11D1M Global Supplier

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H11D1M Specifications

Attribute	Attribute Value

Part Number	H11D1M
Manufacturer	Fairchild
ChipWorker Part#	CW70228536
Category	Optocoupler, Optoisolator
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	6 Pin
Case/Package	DIP-6
Output Voltage	300 V
Number of Channels	1 Channel
Number of Positions	6 Position
Forward Voltage	1.15 V
Power Dissipation	300 mW
Rise Time	5 µs
Isolation Voltage	4170 Vrms
Forward Current	80 mA
Output Voltage (Max)	300 V
Input Current (Min)	80 mA
Reverse Breakdown Voltage	6 V
Maximum Forward Voltage (Max)	1.5 V
Forward Current (Max)	80 mA
Fall Time	5 µs
Operating Temperature (Max)	100 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	300 mW
	expand all
Size-Length	8.89 mm
Size-Width	6.86 mm
Size-Height	3.53 mm
Operating Temperature	-40℃ ~ 100℃
Product Lifecycle Status	Active
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

General Description
The 4N38M, H11DXM and MOC8204M are phototransistor-type optically coupled optoisolators. A gallium arsenide infrared emitting diode is coupled with a high voltage NPN silicon phototransistor. The device is supplied in a standard plastic six-pin dual-in-line package.
Features
■ High voltage:
– MOC8204M, BVCER = 400V
– H11D1M, H11D2M, BVCER = 300V
– H11D3M, BVCER = 200V
■ High isolation voltage:
– 7500 VAC peak, 1 second
■ Underwriters Laboratory (UL) recognized File # E90700, Volume 2
■ IEC 60747-5-2 approved (ordering option V)
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls

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Delivery

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Chipworker Certification

Ordering Information

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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