LM3409HVMY - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LM3409HVMY
Manufacturer

TI
ChipWorker Part#

CW77186450
Category

LED Driver, LED Display Driver
Package

MSOP-10
Description

LED Driver 9V/12V/15V/18V/24V Automotive 10Pin HVSSOP EP T/R
Documentation

Datasheet

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LM3409HVMY Specifications

Attribute	Attribute Value

Part Number	LM3409HVMY
Manufacturer	TI
ChipWorker Part#	CW77186450
Category	LED Driver, LED Display Driver
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	10 Pin
Case/Package	MSOP-10
Number of Outputs	1 Output
Output Current	1 A
Number of Positions	10 Position
Switching Frequency	2 MHz
Topology	Buck
Input Voltage (Max)	75 V
Input Voltage (Min)	6 V
Output Voltage (Max)	75 V
Output Current (Max)	5 A
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	75 V
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Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

The LM3409HVMY is a PFET Buck Controller for high power LED drivers. This controller offers wide input voltage range, high-side differential current sense with low adjustable threshold voltage and fast output enable/disable function and ideal for use as constant current sources for driving LEDs where forward currents up to 5A are easily achievable. The LM3409 use Constant Off-Time (COFT) control to regulate an accurate constant current without the need for external control loop compensation. Analogue and PWM dimming are easy to implement and result in a highly linear dimming range with excellent achievable contrast ratios. Programmable UVLO, low-power shutdown and thermal shutdown complete the feature set.
Differential, high-side current sense
Cycle-by-cycle current limit
No control loop compensation required
Supports all-ceramic output capacitors and capacitor-less outputs
Low-power shutdown and thermal shutdown
This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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- Anti-vibration foam
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