LPS331APTR - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LPS331APTR
Manufacturer

ST Microelectronics
ChipWorker Part#

CW44062303
Category

Pressure Sensor
Package

HCLGA-16
Description

Pressure Sensor 3.77PSI ~ 18.27PSI (26 kPa ~ 126 kPa) Absolute 24B 16-VFLGA
Documentation

Datasheet

LPS331APTR Global Supplier

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LPS331APTR Specifications

Attribute	Attribute Value

Part Number	LPS331APTR
Manufacturer	ST Microelectronics
ChipWorker Part#	CW44062303
Category	Pressure Sensor
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	16 Pin
Case/Package	HCLGA-16
Supply Voltage (DC)	1.71V (min)
Supply Current	30.0 µA
Number of Positions	16 Position
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	1.7V ~ 3.6V
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	1.71 V
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Size-Length	3 mm
Size-Width	3 mm
Size-Height	1 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The LPS331APTR is an ultra compact absolute piezo-resistive Pressure Sensor for indoor and outdoor navigation. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world. The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detecting pressure and is manufactured using a dedicated process developed by ST called VENSENS. The VENSENS process allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. The membrane is very small compared to the traditionally built silicon micro-machined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper. The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
High-resolution mode of 0.02mbar RMS
High overpressure capability of 20x full scale
Embedded temperature compensation
Embedded 24-bit ADC
SPI and I²C interfaces
10000g High shock survivability
ESD sensitive device, take proper precaution while handling the device.

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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