LSM6DS3H - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LSM6DS3H
Manufacturer

ST Microelectronics
ChipWorker Part#

CW471617738
RoHS

Lead free / RoHS Compliant
Description

Accelerometer and Gyroscope Digital Output 1.8V 14Pin LGA Tray
Documentation

Datasheet

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LSM6DS3H Specifications

Attribute	Attribute Value

Part Number	LSM6DS3H
Manufacturer	ST Microelectronics
ChipWorker Part#	CW471617738
Documentation	Datasheet
Number of Pins	14 Pin
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
	expand all
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
ECCN Code	EAR99

Product Description

The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3H is available in a plastic land grid array (LGA) package.
**Key Features**
Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Interface flexibility: selectable SPI (3/4-wire) or I2 C with the main processor
Auxiliary SPI (3-wire) to support OIS applications
EIS/OIS support
Accelerometer ODR up to 6.66 kHz
Gyroscope ODR up to 3.33 kHz
Smart FIFO
±2/±4/±8/±16 g full scale
±125/±250/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I2 C serial interface data synchronization feature
Embedded temperature sensor
ECOPACK® , RoHS and “Green” compliant

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