MAX3232EIPWG4 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MAX3232EIPWG4
Manufacturer

TI
ChipWorker Part#

CW96243197
Category

Interface IC, Interface Controller
Package

TSSOP-16
Description

3V to 5.5V Multichannel S-232 Line Driver/ eceiver With +/-15kV IEC ESD Protection 16-TSSOP -40℃ to 85℃
Documentation

Datasheet

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MAX3232EIPWG4 Specifications

Attribute	Attribute Value

Part Number	MAX3232EIPWG4
Manufacturer	TI
ChipWorker Part#	CW96243197
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	16 Pin
Case/Package	TSSOP-16
Supply Voltage (DC)	3.30 V, 5.00 V
Supply Current	1 mA
Number of Positions	16 Position
Data Rate	250 kbps
Drivers Per Package	2
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	3V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	3 V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

The MAX3232EIPWG4 is a Multichannel RS-232 Line Driver/Receiver with ±15kV IEC ESD protection. This device consists of two line drivers, two-line receivers and a dual charge-pump circuit with ±15kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3 to 5.5V supply. The devices operate at data signalling rates up to 250kbps and a maximum of 30-V/µs driver output slew rate.
Two drivers and two receivers
4 x 0.1µF External capacitors
Alternative high-speed terminal-compatible devices
ESD protection for RS-232 bus pins
Green product and no Sb/Br
This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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- Anti-vibration foam
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