OMAP3530DCBB72 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OMAP3530DCBB72
Manufacturer

TI
ChipWorker Part#

CW116271319
Category

Microprocessor IC
Package

FCBGA-515
Description

IC MPU OMAP-35XX 720MHz 515FCBGA
Documentation

Datasheet

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OMAP3530DCBB72 Specifications

Attribute	Attribute Value

Part Number	OMAP3530DCBB72
Manufacturer	TI
ChipWorker Part#	CW116271319
Category	Microprocessor IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	515 Pin
Case/Package	FCBGA-515
Frequency	520 MHz
Clock Speed	520 MHz
RAM Memory Size	64 KB
Number of Bits	32 Bit
Number of UARTs	3 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
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Operating Temperature	0℃ ~ 90℃ (TJ)
Product Lifecycle Status	Obsolete
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
HK STC License	NLR

Product Description

Description
OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
• Streaming video
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
• Linux®
• Windows® CE
• Android™
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
Features
• OMAP3530 and OMAP3525 Devices:
– OMAP™ 3 Architecture
– MPU Subsystem
• Up to 720-MHz ARM® Cortex™-A8 Core
• NEON™ SIMD Coprocessor
– High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
• Up to 520-MHz TMS320C64x+™ DSP Core
• Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
• Video Hardware Accelerators
– PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only)
• Tile-Based Architecture Delivering up to 10 MPoly/sec
• Universal Scalable Shader Engine: Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
• Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
• Fine-Grained Task Switching, Load Balancing, and Power Management
• Programmable High-Quality Image Anti-Aliasing
– Fully Software-Compatible with C64x and ARM9™
– Commercial and Extended Temperature Grades
• Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core
– Eight Highly Independent Functional Units
• Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
• Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
– Load-Store Architecture with Nonaligned Support
– 64 32-Bit General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Additional C64x+ Enhancements
• Protected Mode Operation
• Exceptions Support for Error Detection and Program Redirection
• Hardware Support for Modulo Loop Operation
• C64x+ L1 and L2 Memory Architecture
– 32KB of L1P Program RAM and Cache (Direct Mapped)
– 80KB of L1D Data RAM and Cache (2-Way Set-Associative)
– 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative)
– 32KB of L2 Shared SRAM and 16KB of L2 ROM
• C64x+ Instruction Set Features
– Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
– 8-Bit Overflow Protection
– Bit Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– Compact 16-Bit Instructions
– Additional Instructions to Support Complex Multiplies
• ARM Cortex-A8 Core
– ARMv7 Architecture
• TrustZone®
• Thumb®-2
• MMU Enhancements
– In-Order, Dual-Issue, Superscalar Microprocessor Core
– NEON Multimedia Architecture
– Over 2x Performance of ARMv6 SIMD
– Supports Both Integer and Floating-Point SIMD
– Jazelle® RCT Execution Environment Architecture
– Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
– Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
Applications
• Portable Navigation Devices
• Portable Media Player
• Digital Video Camera
• Portable Data Collection
• Point-of-Sale Devices
• Gaming
• Web Tablet
• Smart White Goods
• Smart Home Controllers

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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